Our Applications Center Is Equipped with a Full Compliment of Photovoltaic Processing Platforms outfitted with a wide range of laser sources. Our knowledgeable staff is dedicated to the development of new and novel processing techniques that employ our proprietary beam shaping optics in conjunction with our high-speed, precision motion platforms.
| Near Infrared | Visible | Ultraviolet | |
| c-SI PV CELLS | |||
| Edge Isolation | * | * | * |
| Via Drilling | * | * | * |
| Wafer Cutting | * | ||
| Wafer Marking | * | * | |
| Diffusion | * | ||
| Stringers/Solder | * | ||
| Channels | * | * | * |
| Buried Contacts | * | * | * |
| Thin-Film Substrates | |||
| P1, P2 & P3 Layers | * | * | * |
| Edge Isolation | * | * | |
| Edge Delete | * | * | |
| Defect Mitigation | * | * | |
| Sub-Surface Marking | * | * | |